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集成电路芯片管脚在插入印刷电路板后，需要检测管脚是否全部就位，之后才会进入焊接流程。芯片管脚就位的整体平整度对电路板焊接质量至关重要。在先进的贴片机中，元器件的整体平整度可以通过激光三角反射式位移传感器进行实时在线检测。
The term ?co-planarity“ describes theproper seating of the tips of fine-pitch device leads on the copper pads on aPCB prior to solder process. The co-planarity is a critical dimension for thequality of the soldered joints, because no reliable and correct soldering canbe done if there is a gap between the lead and the pad. In state of the artautomatic assembly machines the co-planarity of components is measured duringthe assembling process. The component to be measured is passed over a triangulationdisplacement sensor which has a laser beam that scans the row of pins.
